Description
- Wire to Board
- 2.50mm Pitch Crimp Style Wafer
- Vertical
- DIP
- 02~20Pins
- White Color
Material
- Housing: Nylon 66, UL 94V-2 Rated.
- Color: White.
- Contact: Brass.
- Plating: Tin Plating over Nickel.
Tin Plating on Solder Tail.
Electrical Specification
- Operation Voltage: 125V AC/DC.
- Current Rating: 3 Ampere AC/DC per Contact.
- Contact Resistance: 20mΩ Max.
- Insulation Resistance: 1000MΩ Min.
- Dielectric Withstanding Voltage: 1000V AC per Minute.
Environmental
- Operating Temperature: -25°C to +85°C.
- Package: 1,000pcs/Bag.
- RoHS Compliance.
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